2UUL Repair Want DA12 YCS 3 in 1 Blades Set for IC Disassemble

2UUL Repair Want DA12 Y-C-S 3 in 1 Blades Set for IC Disassemble

Description:

Professional maintenance tool set for removing mobile phone chip.
BGA repair, disassembly of CPU chip and mobile phone repair.
Three different specifications for different needs.
It can be used to separate welds.
Used to dismantle circuit board chip and other components.

Features:

The knife blades are made of stainless steel
Multiple Ultra-thin blades, capricious good, it can ease between the chip and the phone circuit board at the end, is not easy to lead off point.

Specifications:

Material: plastic & stainless steel
Quantity: 3pcs/set

Application:

Mobile Phone BGA IC Chip Repair
CPU Glue Removing Tools
Motherboard BGA Dissembling and Assembling
Package included:
1 set × 3 in 1 IC Chip Repair Thin Blade