Skip to product information
1 of 5

Fonekong Solder Paste PPD 183℃

Fonekong Solder Paste PPD 183℃

No reviews

Brand : Fonekong

Regular price Rs. 300.00
Regular price Sale price Rs. 300.00
Sale Sold out
Tax included.

Fonekong Solder Paste PPD 183℃

Product Description

Temperature: 183℃ FONEKONG
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Feature :
  • Excellent capacity of solder-stickiness

  • Excellent Anti-wet Capacity

  • Widely used on BGA, PGA, CSP packages and flip chip operation

  • Suitable for multiple PCB reflow

  • No-clean and Lead free for environmental protection

View full details